Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: CDIP
External dimensions/packaging: CDIP
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BLF1043,112
|
NXP | 类似代替 | SOT-538 |
Trans RF MOSFET N-CH 65V 2.2A 3Pin CDIP SMD Bulk
|
||
BLF1043,112
|
Ampleon USA | 类似代替 | CDIP-538 |
Trans RF MOSFET N-CH 65V 2.2A 3Pin CDIP SMD Bulk
|
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