Technical parameters/frequency: 5.5 kHz
Encapsulation parameters/installation method: Solder
Encapsulation parameters/Encapsulation: -
External dimensions/length: 7.87 mm
External dimensions/width: 5.59 mm
External dimensions/height: 4.01 mm
External dimensions/packaging: -
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
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