Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube, Rail
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX5916EUI+
|
Maxim Integrated | 功能相似 | TSSOP-28 |
热交换电压控制器 Dual PCI 2.2 Hot Swap Controller
|
||
MAX5916UUI+T
|
Maxim Integrated | 功能相似 | TSSOP-28 |
Hot Swap Controller 2CH 13.2V 28Pin TSSOP T/R
|
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