Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: HBGA
External dimensions/packaging: HBGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT82P2521BH
|
Integrated Device Technology | 功能相似 |
Ic Liu E1 21+1CH Short 640-Pbga
|
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