Technical parameters/minimum current amplification factor (hFE): 50
Technical parameters/operating temperature (Max): 150 ℃
Technical parameters/operating temperature (Min): -65 ℃
Technical parameters/dissipated power (Max): 1.1 W
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: SOT-89-3
External dimensions/length: 4.6 mm
External dimensions/width: 2.6 mm
External dimensions/height: 1.6 mm
External dimensions/packaging: SOT-89-3
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
CJ | 功能相似 | SOT-89-3 |
高电压晶体管,Nexperia ### 双极晶体管,Nexperia
|
||
BF622
|
Siemens Semiconductor | 功能相似 |
高电压晶体管,Nexperia ### 双极晶体管,Nexperia
|
|||
BF622
|
NXP | 功能相似 | SOT-89-3 |
高电压晶体管,Nexperia ### 双极晶体管,Nexperia
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review