Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: TO-236
External dimensions/packaging: TO-236
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BC817,215
|
Nexperia | 类似代替 | SOT-23-3 |
NXP BC817,215 单晶体管 双极, 通用, NPN, 45 V, 100 MHz, 250 mW, 500 mA, 100 hFE
|
||
BC817,235
|
Nexperia | 类似代替 | SOT-23-3 |
TO-236AB NPN 45V 0.5A
|
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