Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: SOT-323
External dimensions/packaging: SOT-323
Other/Product Lifecycle: End of Life
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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|
Philips | 功能相似 | SC-70 |
NXP BC860CW,115 单晶体管 双极, PNP, -45 V, 100 MHz, 200 mW, -100 mA, 420 hFE
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