Chip AI consultant
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/EU RoHS: Compliant
Other/Family Name: BCM1125H
Other/Data Bus Width (bits): 64
Other/Device Core: SB-1
Other/Number of CPU Cores: 1
Other/Structure Cache Size: 32KB
Other/Data Cache Size: 32KB
Other/Multiple Accumulate: No
Other/Counting: Surface Mount
Other/Standard Package Name: BGA
Other/Supplier Package: BGA
Other/Lead Shape: Ball
Compliant with standards/RoHS standards: RoHS Compliant
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