Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: 3DFN
External dimensions/packaging: 3DFN
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BC857BLP-7B
|
Diodes | 类似代替 | DFN-3 |
BC857BLP 系列 45 V 0.1 A 400 mW PNP 小信号 晶体管 - DFN1006-3
|
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