Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: SC-70
External dimensions/packaging: SC-70
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BC807-40W,115
|
NXP | 功能相似 | SOT-323-3 |
Nexperia BC807-40W,115 , PNP 晶体管, 500 mA, Vce=45 V, HFE:250, 3引脚 SOT-323 (SC-70)封装
|
||
BC807-40W,115
|
Nexperia | 功能相似 | SOT-323-3 |
Nexperia BC807-40W,115 , PNP 晶体管, 500 mA, Vce=45 V, HFE:250, 3引脚 SOT-323 (SC-70)封装
|
||
BC807-40W,115
|
Philips | 功能相似 | SC-70 |
Nexperia BC807-40W,115 , PNP 晶体管, 500 mA, Vce=45 V, HFE:250, 3引脚 SOT-323 (SC-70)封装
|
||
BSP33,115
|
NXP | 功能相似 | TO-261-4 |
双极性晶体管, 中等功率, PNP, -80V, -1A, 4SOT223
|
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