Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 2
Encapsulation parameters/Encapsulation: Mini-MELF
External dimensions/packaging: Mini-MELF
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BAV102,135
|
NXP | 功能相似 | Mini-MELF |
DIODE SW G-P 200V 250mA SOD80C
|
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