Technical parameters/frequency: 100 MHz
Technical parameters/RAM size: 64 KB
Technical parameters/FLASH memory capacity: 512 KB
Technical parameters/operating temperature (Max): 100 ℃
Technical parameters/operating temperature (Min): -40 ℃
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: FPBGA-256
External dimensions/packaging: FPBGA-256
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
A2F500M3G-1FG256I
|
Microsemi | 完全替代 | FPBGA-256 |
FPGA SmartFusion Family 500K Gates 100MHz 130nm Technology 1.5V 256Pin FBGA
|
||
A2F500M3G-FG256I
|
SOC | 完全替代 | LBGA-256 |
FPGA SmartFusion Family 500K Gates 100MHz 130nm Technology 1.5V 256Pin FBGA
|
||
A2F500M3G-FGG256I
|
Microsemi | 完全替代 | FPBGA-256 |
ARM Cortex-M3 80MHz 闪存:512KB RAM:64KB
|
||
A2F500M3G-FGG256I
|
SOC | 完全替代 | LBGA-256 |
ARM Cortex-M3 80MHz 闪存:512KB RAM:64KB
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review