Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SMD-9
External dimensions/packaging: SMD-9
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
B39212B8092P810
|
RF360 | 功能相似 | 2.5 mm x 2 mm |
RF Duplexer 2110MHz to 2170MHz 1920MHz to 1980MHz 9Pin SMD
|
||
B39212B8092P810
|
Qualcomm | 功能相似 | SMD-9 |
RF Duplexer 2110MHz to 2170MHz 1920MHz to 1980MHz 9Pin SMD
|
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