Technical parameters/power supply voltage: 1.425V ~ 1.575V
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BGA-484
External dimensions/packaging: BGA-484
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
AX500-2FG484I
|
Microsemi | 类似代替 | FBGA-484 |
FPGA Axcelerator Family 286K Gates 5376 Cells 870MHz 0.15um Technology 1.5V 484Pin FBGA
|
||
AX500-2FG484I
|
SOC | 类似代替 | BGA-484 |
FPGA Axcelerator Family 286K Gates 5376 Cells 870MHz 0.15um Technology 1.5V 484Pin FBGA
|
||
AX500-2FGG484
|
Microsemi | 类似代替 | FBGA-484 |
FPGA - 现场可编程门阵列 AX500-2FGG484 LEAD FREE
|
||
AX500-FG484
|
Microsemi | 类似代替 | FBGA-484 |
FPGA Axcelerator Family 286K Gates 5376 Cells 649MHz 0.15um Technology 1.5V 484Pin FBGA
|
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