Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): 55 ℃
Technical parameters/power supply voltage (Max): 1.575 V
Technical parameters/power supply voltage (Min): 1.425 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 484
Encapsulation parameters/Encapsulation: FBGA
External dimensions/length: 23 mm
External dimensions/width: 23 mm
External dimensions/height: 1.73 mm
External dimensions/packaging: FBGA
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
AX500-1FGG484
|
Microsemi | 类似代替 | BGA-484 |
FPGA Axcelerator Family 286K Gates 5376 Cells 763MHz 0.15um Technology 1.5V 484Pin FBGA
|
||
AX500-1FGG484
|
SOC | 类似代替 | BGA-484 |
FPGA Axcelerator Family 286K Gates 5376 Cells 763MHz 0.15um Technology 1.5V 484Pin FBGA
|
||
AX500-1FGG484
|
Microchip | 类似代替 | FBGA |
FPGA Axcelerator Family 286K Gates 5376 Cells 763MHz 0.15um Technology 1.5V 484Pin FBGA
|
||
AX500-FG484
|
Microsemi | 功能相似 | FBGA-484 |
FPGA Axcelerator Family 286K Gates 5376 Cells 649MHz 0.15um Technology 1.5V 484Pin FBGA
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review