Technical parameters/power supply voltage: 1.425V ~ 1.575V
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BGA-676
External dimensions/packaging: BGA-676
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
AX500-2FGG676
|
Microchip | 完全替代 | FBGA |
FPGA Axcelerator Family 286K Gates 5376 Cells 870MHz 0.15um Technology 1.5V 676Pin FBGA
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review