Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): 55 ℃
Technical parameters/power supply voltage (Max): 1.575 V
Technical parameters/power supply voltage (Min): 1.425 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: FBGA
External dimensions/length: 17 mm
External dimensions/width: 17 mm
External dimensions/height: 1.2 mm
External dimensions/packaging: FBGA
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
AX250-FGG256
|
Microsemi | 类似代替 | LBGA-256 |
Field Programmable Gate Array, 2816 CLBs, 250000Gates, 649MHz, 4224-Cell, CMOS, PBGA256, 1MM PITCH, ROHS COMPLIANT, FBGA-256
|
||
AX250-FGG256
|
SOC | 类似代替 | LBGA-256 |
Field Programmable Gate Array, 2816 CLBs, 250000Gates, 649MHz, 4224-Cell, CMOS, PBGA256, 1MM PITCH, ROHS COMPLIANT, FBGA-256
|
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