Technical parameters/RAM size: 16K x 8
Package parameters/number of pins: 100
Encapsulation parameters/Encapsulation: TFBGA-100
External dimensions/packaging: TFBGA-100
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ATSAM3S1CA-CUR
|
ATMEL | 完全替代 | BGA-100 |
IC MCU 32Bit 64KB FLASH 100TFBGA
|
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