Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: UFDFN-8
External dimensions/height: 0.55 mm
External dimensions/packaging: UFDFN-8
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
Other/Manufacturing Applications: Network and Communication
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ATECC108A-MAHCZ-T
|
Microchip | 功能相似 | UDFN-8 |
EEPROM CRYPTO 8KB SGL WIRE 8UDFN
|
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