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Model 87797-1200
Description 2.54Millimeter (. 100) spacing C-Grid ® Head, through-hole, dual row dual body, vertical, 12 circuits, 0.76 μ m (30 μ), gold (Au), electroplating, 8.00 mm (0.315) stacking height 2.54mm (. 100) Pitch C-Grid ® Header, Through Hole, Dual Row Dual Body, Vertical, 12 Circuits, 0.76μm (30μ) Gold (Au) Plating, 8.00mm (.315) Stacking Height
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Brand: Molex
Packaging
Delivery time
Packaging method Tray
Standard packaging quantity 1
8.81  yuan 8.81yuan
10+:
$ 10.5708
100+:
$ 10.0423
500+:
$ 9.6899
1000+:
$ 9.6723
2000+:
$ 9.6018
5000+:
$ 9.5137
7500+:
$ 9.4432
10000+:
$ 9.4080
Quantity
10+
100+
500+
1000+
2000+
Price
$10.5708
$10.0423
$9.6899
$9.6723
$9.6018
Price $ 10.5708 $ 10.0423 $ 9.6899 $ 9.6723 $ 9.6018
Start batch production 10+ 100+ 500+ 1000+ 2000+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(6379) Minimum order quantity(10)
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Technical parameters/Contact electroplating: Tin, Gold

Technical parameters/rated current: 3.00 A

Technical parameters/number of rows: 2

Technical parameters/hot wire testing standards: Non-Compliant

Technical parameters/halogen-free state: Low Halogen

Technical parameters/direction: Vertical

Technical parameters/number of circuits: 12

Technical parameters/Flammability level: UL 94 V-0

Technical parameters/number of pins: 12

Encapsulation parameters/installation method: Through Hole

Dimensions/Insertion Height: 5.00 mm

Physical parameters/materials: Copper Alloy

Other/Product Lifecycle: Active

Other/Packaging Methods: Tray

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

Compliant with standards/ELV standards: Compliant

Compliant with standards/REACH SVHC standards: No SVHC

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