Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: UFDFN-8
External dimensions/packaging: UFDFN-8
Other/Product Lifecycle: Obsolete
Other/Manufacturing Applications: Network and Communication
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ATAES132-MA3H-ER-T
|
Microchip | 功能相似 | UFDFN-8 |
IC EEPROM 32Kbit 1MHz 8UDFN
|
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