Technical parameters/tolerances: ±5 %
Technical parameters/forward voltage: 1.1V @200mA
Technical parameters/dissipated power: 500 mW
Technical parameters/test current: 5 mA
Technical parameters/voltage regulation value: 5.1 V
Technical parameters/rated power (Max): 500 mW
Technical parameters/operating temperature (Max): 175 ℃
Technical parameters/operating temperature (Min): -65 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 2
Encapsulation parameters/Encapsulation: DO-213AA
External dimensions/packaging: DO-213AA
Physical parameters/operating temperature: -65℃ ~ 175℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
1N5523BUR-1
|
Microchip | 完全替代 | DO-213AA-2 |
无铅封装用于表面安装齐纳二极管500mW的 LEADLESS PACKAGE FOR SURFACE MOUNT ZENER DIODE, 500mW
|
||
1N5523BUR-1
|
Microsemi | 完全替代 | DO-213AA |
无铅封装用于表面安装齐纳二极管500mW的 LEADLESS PACKAGE FOR SURFACE MOUNT ZENER DIODE, 500mW
|
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