Technical parameters/tolerances: ±0.1 %
Technical parameters/rated power: 0.167 W
Technical parameters/resistance: 3.01 KΩ
Technical parameters/resistance deviation: ±0.1 %
Technical parameters/operating temperature (Max): 155 ℃
Technical parameters/operating temperature (Min): -55 ℃
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation (metric): 1608
Encapsulation parameters/Encapsulation: 0603
External dimensions/length: 1.6 mm
External dimensions/width: 0.8 mm
External dimensions/height: 0.45 mm
Dimensions/Packaging (Metric): 1608
External dimensions/packaging: 0603
Physical parameters/operating temperature: -55℃ ~ 155℃
Physical parameters/temperature coefficient: ±25 ppm/℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CPF0603B3K01E1
|
TE Connectivity | 类似代替 | 0603 |
TE CONNECTIVITY CPF0603B3K01E1 片式电阻器, 表面贴装, 薄膜, CPF系列, 3.01 kohm, 50 V, 0603 [1608公制], 63 mW, ± 0.1%
|
||
CPF0603F3K01C1
|
Neohm | 类似代替 | 0603 |
Res Thin Film 0603 3.01KΩ 1% 0.063W(1/16W) ±50ppm/℃ Molded SMD SMD Paper T/R
|
||
CPF0603F3K01C1
|
TE Connectivity | 类似代替 | 0603 |
Res Thin Film 0603 3.01KΩ 1% 0.063W(1/16W) ±50ppm/℃ Molded SMD SMD Paper T/R
|
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