Technical parameters/gain bandwidth product: 1 MHz
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOP
External dimensions/length: 4.95 mm
External dimensions/width: 3.95 mm
External dimensions/height: 1.5 mm
External dimensions/packaging: SOP
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LMV358IDRG4
|
TI | 功能相似 | SOIC-8 |
低电压轨到轨输出运算放大器 LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
|
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