Technical parameters/thermal resistance: 3.80 K/W
Technical parameters/thermal resistance (forced airflow): 3.80℃/W @200LFM
Encapsulation parameters/Encapsulation: BGA
External dimensions/length: 32.60 mm
External dimensions/width: 32.6 mm
External dimensions/height: 12.0 mm
External dimensions/packaging: BGA
Physical parameters/color: Black
Physical parameters/materials: Aluminum
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review