Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: LFBGA
External dimensions/packaging: LFBGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74LVCH322245AEC/G
|
NXP | 功能相似 | LFBGA |
Bus XCVR Quad 32CH 3-ST 96Pin LFBGA Tray
|
||
IDT74ALVCH32245BFG8
|
Integrated Device Technology | 功能相似 | LFBGA |
IC TRANSCVR TRI-ST 32Bit 96LFBGA
|
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