Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Encapsulation parameters/Encapsulation: FBGA
External dimensions/length: 13 mm
External dimensions/width: 13 mm
External dimensions/height: 1.05 mm
External dimensions/packaging: FBGA
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
APA450-FG144
|
SOC | 完全替代 | LBGA-144 |
FPGA - 现场可编程门阵列 ProASIC Plus
|
||
APA450-FG144I
|
Microsemi | 完全替代 | FBGA-144 |
Field Programmable Gate Array, 450000Gates, 180MHz, 12288-Cell, CMOS, PBGA144, 1MM PITCH, FBGA-144
|
||
APA450-FGG144I
|
SOC | 完全替代 | LBGA-144 |
Field Programmable Gate Array, 450000Gates, 180MHz, 12288-Cell, CMOS, PBGA144, 1MM PITCH, ROHS COMPLIANT, FBGA-144
|
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