Technical parameters/power supply voltage (DC): 3.30 V
Technical parameters/number of logic gates: 3
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 14
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Cut Tape (CT)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Rochester | 完全替代 |
74系列逻辑芯片/74LVC11PW
|
|||
74LVC11PW
|
Nexperia | 完全替代 | TSSOP |
74系列逻辑芯片/74LVC11PW
|
||
74LVC11PW
|
NXP | 完全替代 | TSSOP-14 |
74系列逻辑芯片/74LVC11PW
|
||
74LVC11PW,112
|
Nexperia | 完全替代 | TSSOP-14 |
NXP 74LVC11PW,112 2个 3输入 AND 逻辑门, 单端输出, 24mA, 1.65 → 3.6 V电源, 14引脚 TSSOP封装
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review