Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 2.3V ~ 2.7V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: BGA-256
External dimensions/packaging: BGA-256
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
APA450-FG256I
|
Microsemi | 功能相似 | FBGA-256 |
Field Programmable Gate Array, 450000Gates, 180MHz, 12288-Cell, CMOS, PBGA256, 1MM PITCH, FBGA-256
|
||
APA450-FG256I
|
SOC | 功能相似 | LBGA-256 |
Field Programmable Gate Array, 450000Gates, 180MHz, 12288-Cell, CMOS, PBGA256, 1MM PITCH, FBGA-256
|
||
APA450-FGG256I
|
Microsemi | 功能相似 | FBGA-256 |
Field Programmable Gate Array, 450000Gates, 180MHz, 12288-Cell, CMOS, PBGA256, 1MM PITCH, ROHS COMPLIANT, FBGA-256
|
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