Technical parameters/power supply voltage: 1.2V ~ 3.6V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 60
Encapsulation parameters/Encapsulation: XFQFN-60
External dimensions/packaging: XFQFN-60
Physical parameters/operating temperature: -40℃ ~ 125℃ (TA)
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74LVC16244ABQ,518
|
NXP | 完全替代 | XFQFN-60 |
Buffer/Line Driver 16CH Non-Inverting 3-ST CMOS 60Pin HXQFN-U EP T/R
|
||
74LVC16244AEV,118
|
Nexperia | 功能相似 | SOT-702-56 |
Buffer/Line Driver 16CH Non-Inverting 3-ST CMOS 56Pin VFBGA T/R
|
||
74LVC16244AEV/G,51
|
Nexperia | 功能相似 | VFBGA-56 |
Buffer/Line Driver 16CH Non-Inverting 3-ST CMOS 56Pin VFBGA Tray
|
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