Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Rochester | 功能相似 | SOP |
八路D型IP- FL佛罗里达州运与三态输出 Octal D-Type Flip-Flop with 3-STATE Outputs
|
||
74F534SC
|
Fairchild | 功能相似 | SOIC-20 |
八路D型IP- FL佛罗里达州运与三态输出 Octal D-Type Flip-Flop with 3-STATE Outputs
|
||
|
|
ON Semiconductor | 功能相似 | SOIC-20 |
Flip Flop D-Type Bus Interface Pos-Edge 3-ST 1Element 20Pin SOIC W T/R
|
||
74F534SCX
|
Fairchild | 功能相似 | SOIC-20 |
Flip Flop D-Type Bus Interface Pos-Edge 3-ST 1Element 20Pin SOIC W T/R
|
||
74F534SCX
|
Freescale | 功能相似 |
Flip Flop D-Type Bus Interface Pos-Edge 3-ST 1Element 20Pin SOIC W T/R
|
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