Technical parameters/digits: 1
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 5
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/length: 2 mm
External dimensions/width: 1.25 mm
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74AUP1G126GW
|
Rochester | 功能相似 |
IC, BUFF/DVR, 3-ST, LOW PWR, TSSOP5; Logic Device Type: Buffer / Line Driver, Non Inverting; Supply Voltage Min: 0.8V...
|
|||
74AUP1G126GW
|
NXP | 功能相似 | SOT-353 |
IC, BUFF/DVR, 3-ST, LOW PWR, TSSOP5; Logic Device Type: Buffer / Line Driver, Non Inverting; Supply Voltage Min: 0.8V...
|
||
74AUP1G126GW
|
Nexperia | 功能相似 | TSSOP |
IC, BUFF/DVR, 3-ST, LOW PWR, TSSOP5; Logic Device Type: Buffer / Line Driver, Non Inverting; Supply Voltage Min: 0.8V...
|
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