Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tube, Rail
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CD74AC373E
|
TI | 功能相似 | PDIP-20 |
闭锁 Octal Transparent 闭锁
|
||
TC74AC373P
|
Toshiba | 功能相似 | DIP |
Latch Transparent 3-ST 8CH D-Type 20Pin PDIP Tube
|
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