Technical parameters/number of channels: 1
Technical parameters/dissipated power: 4.6 W
Technical parameters/gain: 19 dB
Technical parameters/power supply voltage (Max): 5.5 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 10
Encapsulation parameters/Encapsulation: SMD
External dimensions/packaging: SMD
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HMC-ALH444
|
ADI | 功能相似 | 压铸 |
ANALOG DEVICES HMC-ALH444 芯片, 射频放大器, 17DB, 12GHZ, 5V, 压铸
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TGA2513
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TriQuint | 功能相似 | DIE (2.09 mm x 1.35 mm) / Wafer |
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TGA2525
|
TriQuint | 功能相似 |
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