Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 655
Encapsulation parameters/Encapsulation: FCBGA-655
External dimensions/length: 24.5 mm
External dimensions/width: 19.5 mm
External dimensions/packaging: FCBGA-655
External dimensions/thickness: 2.55 mm
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review