Technical parameters/access time: 5 ns
Technical parameters/power supply voltage: 3.15V ~ 3.45V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 128
Encapsulation parameters/Encapsulation: LQFP-128
External dimensions/length: 20.0 mm
External dimensions/width: 14.0 mm
External dimensions/packaging: LQFP-128
External dimensions/thickness: 1.40 mm
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
72V3680L6BBG8
|
Renesas Electronics | 功能相似 | BGA-144 |
16K x 36 SuperSync II FIFO, 3.3V
|
||
IDT72V3680L7-5BBI
|
Integrated Device Technology | 功能相似 | BGA |
FIFO Mem Sync Dual Depth/Width Uni-Dir 16K x 36 144Pin BGA
|
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