Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 32
Encapsulation parameters/Encapsulation: LQFP
External dimensions/packaging: LQFP
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT72V231L20PF
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Integrated Device Technology | 功能相似 | LQFP |
3.3伏的CMOS SyncFIFO⑩ 256 ×9 , 512× 9 , 1,024× 9 , 2048 ×9 , 4096 ×9和8,192 ×9 3.3 VOLT CMOS SyncFIFO⑩ 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9 and 8,192 x 9
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