Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: LQFP
External dimensions/packaging: LQFP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Integrated Device Technology | 功能相似 | LBGA-100 |
128K x 18 / 256K x 9 SuperSync II FIFO, 3.3V
|
||
72V2103L6PFG8
|
Integrated Device Technology | 功能相似 | LQFP-80 |
128K x 18 / 256K x 9 SuperSync II FIFO, 3.3V
|
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