Chip AI consultant
Package parameters/number of pins: 32
Encapsulation parameters/Encapsulation: PLCC-32
External dimensions/packaging: PLCC-32
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
7203L35TP
|
Integrated Device Technology | 功能相似 | PDIP-28 |
FIFO Mem Async Dual Depth/Width Uni-Dir 2K x 9 28Pin PDIP
|
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|
|
Renesas Electronics | 功能相似 | DIP-28 |
FIFO Mem Async Dual Depth/Width Uni-Dir 2K x 9 28Pin PDIP
|
||
IDT7203L35J
|
Integrated Device Technology | 功能相似 | LCC-32 |
CMOS异步FIFO 2048× 9 ， 4096 ×9 ， 8192 ×9和16384 ×9 CMOS ASYNCHRONOUS FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9
|
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