Encapsulation parameters/installation method: Panel
Physical parameters/contact material: Silver Alloy, Beryllium Copper
Other/Lead Finish: Gold
Other/Base/Heating Materials: Diallyl/N/A
Other/Contact Materials: Silver Alloy/Beryllium Copper
Other/Pole Throw Configuration: 3P3T
Other/Counting: Panel Mount
Compliant with standards/RoHS standards: RoHS Compliant
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