Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: TO-39
External dimensions/packaging: TO-39
Other/Product Lifecycle: Active
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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|
Microsemi | 功能相似 | SMD-0 |
Trans GP BJT NPN 80V 2A 3Pin SMD-0.5
|
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Microsemi | 功能相似 | Surface Mount |
Trans GP BJT NPN 80V 2A 3Pin SMD-0.5
|
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