Technical parameters/number of ART: 1
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 160
Encapsulation parameters/Encapsulation: CSP-BGA
External dimensions/length: 12 mm
External dimensions/width: 12 mm
External dimensions/height: 1.21 mm
External dimensions/packaging: CSP-BGA
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: 3A991.a.2
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ADSP-BF533SBBC400
|
ADI | 完全替代 | CSP-BGA |
Blackfin嵌入式处理器 Blackfin Embedded Processor
|
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