Technical parameters/power consumption: 15.5 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ADS8330IBPWG4
|
TI | 功能相似 | TSSOP-16 |
具有 2:1 多路复用器的 2.7V 至 5.5V 16 位 1MSPS 串行 ADC 16-TSSOP -40 to 85
|
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