Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: HSOP
External dimensions/packaging: HSOP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ADP3633ARDZ-RL
|
ADI | 功能相似 | SOIC-8 |
ANALOG DEVICES ADP3633ARDZ-RL 驱动器, MOSFET, 低压侧, 9.5V-18V电源, 4A输出, 22ns延迟, nsOIC-8
|
||
ADP3634ARDZ
|
ADI | 功能相似 | SOIC-8 |
ANALOG DEVICES ADP3634ARDZ 芯片, MOSFET, 低压侧, 9.5V-18V电源, 4A输出, 22ns延迟, SOIC-8
|
||
ADP3635ARDZ-RL
|
ADI | 功能相似 | SOIC-8 |
ANALOG DEVICES ADP3635ARDZ-RL 驱动器, MOSFET, 低压侧, 9.5V-18V电源, 4A输出, 14ns延迟, HSOIC-8
|
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