Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: MSOP-8
External dimensions/packaging: MSOP-8
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ADC121S655CIMM/NOPB
|
National Semiconductor | 完全替代 | MSOP-8 |
12 位、200 kSPS 至 500 kSPS、差动输入、微功耗 A/D 转换器 8-VSSOP 0 to 0
|
||
ADC121S655CIMM/NOPB
|
TI | 完全替代 | VSSOP-8 |
12 位、200 kSPS 至 500 kSPS、差动输入、微功耗 A/D 转换器 8-VSSOP 0 to 0
|
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