Technical parameters/digital logic level: SAR
Technical parameters/number of circuits: 1
Technical parameters/digits: 12
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: LFCSP EP
External dimensions/packaging: LFCSP EP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray, Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review