Technical parameters/dissipated power: 30.0 mW
Technical parameters/resolution (Bits): 8.0
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: PB free
Compliant with standards/military grade: Yes
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