Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HFA1100IP
|
Intersil | 功能相似 | DIP-8 |
850MHz,低变形电流反馈运算放大器
|
||
HFA1100IP
|
Harris | 功能相似 | PDIP-8 |
850MHz,低变形电流反馈运算放大器
|
||
HFA1100IP
|
Renesas Electronics | 功能相似 | DIP-8 |
850MHz,低变形电流反馈运算放大器
|
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