Technical parameters/power supply voltage (DC): 5.00 V, 5.50 V (max)
Technical parameters/clock frequency: 16.0 MHz, 16.0 MHz (max)
Technical parameters/RAM size: 237 x 8
Technical parameters/dissipated power: 1210 mW
Technical parameters/I/O pin count: 24
Technical parameters/access time: 16.0 µs
Technical parameters/kernel architecture: Z8
Technical parameters/dissipated power (Max): 1210 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 28
Encapsulation parameters/Encapsulation: SOIC-28
External dimensions/packaging: SOIC-28
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
Z86E3016SEG
|
Zilog | 完全替代 | SOIC-28 |
8位微控制器 -MCU 4K OTP 16MHz XTEMP
|
||
Z86E3016SSG
|
Zilog | 完全替代 | SOIC-28 |
Z86E30 系列 237 B RAM 16 MHz 表面贴装 Z8® OTP 微控制器 - SOIC-28
|
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