Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: CDIP
External dimensions/length: 25.4 mm
External dimensions/width: 7.62 mm
External dimensions/packaging: CDIP
External dimensions/thickness: 2.90 mm
Physical parameters/operating temperature: -55℃ ~ 125℃
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
5962-9221503MRA
|
TI | 功能相似 | CDIP |
Octal d Register
|
||
5962-9221503MRA
|
Integrated Device Technology | 功能相似 | CDIP |
Octal d Register
|
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